Laser Application DISCO Corporation
Laser Application Ablation Process DAL7020 DFL7020 DFL7161 DFL7160 Stealth Dicing DFL7341 DFL7360FH DFL7361 Laser Lift Off ... After forming a narrow groove with a laser in these difficulttocut materials, the die are separated using a blade or laser dicing. ... 1 pass, 200 µm thick This process realizes high quality, high